14 January, 2026
samsung-s-exynos-2700-promises-significant-performance-boost

Samsung’s development of its in-house Exynos chips may be on the verge of a breakthrough, with leaks indicating that the upcoming Exynos 2700 could significantly enhance performance and efficiency for the Galaxy S27 series, set to launch in 2027. This potential leap forward comes from information shared by tipster Kaulenda on X, highlighting advancements in Samsung’s manufacturing process.

The Exynos 2700 is expected to be built on Samsung Foundry’s refined second-generation 2nm process, known as SF2P. This new manufacturing node reportedly offers a 12% performance increase and a remarkable 25% reduction in power consumption compared to the previous Exynos 2600, which is slated to debut with the Galaxy S26. Enhanced clock speeds are also anticipated, with the primary CPU core potentially reaching stable speeds of 4.2GHz.

Architectural Enhancements and Performance Expectations

Architecturally, the Exynos 2700 is set to incorporate ARM’s next-generation Cortex-C2 cores, which could yield an estimated 35% increase in instructions executed per clock cycle. If these projections are accurate, early estimates suggest the Exynos 2700 could achieve Geekbench 6 scores of approximately 4,800 for single-core performance and around 15,000 in multi-core tests. These figures would represent a substantial improvement over current Exynos models.

One standout feature of the upcoming chip is its innovative cooling system. Samsung is reportedly shifting to an FOWLP-SbS (Side-by-Side) packaging design, which positions the application processor adjacent to the DRAM under a unified copper ‘Heat Path Block’. This design contrasts with the traditional vertical stacking method, potentially increasing the surface area in contact with the heat spreader. Such a change aims to tackle the overheating and throttling issues that have plagued previous Exynos generations.

Boosting Graphics and Data Transfer Speeds

In addition to performance improvements, graphics capabilities are expected to receive a notable upgrade. The next-generation AMD-based Xclipse GPU is anticipated to be paired with LPDDR6 memory and UFS 5.0 storage, which could enable data transfer speeds that are 80% to 100% faster than previous generations. This combination is projected to deliver a real-world GPU performance gain of 30% to 40%, with LPDDR6 supporting speeds of up to 14.4Gbps.

While these insights stem from leaks and have not yet been confirmed by Samsung, the potential of the Exynos 2700 to rival Qualcomm’s top-tier Snapdragon chips is becoming increasingly apparent. If these developments materialize, Samsung may finally establish its Exynos line as a formidable competitor in the smartphone chipset market.